Large Scale Nanoelement Assembly Method for Making Nanotube Circuit Interconnects and Diodes
Northeastern University
posted on 04/26/2009
The invention describes a method for three-dimensional directed assembly of single-wall carbon nanotubes (SWNT) into porous alumina nanotemplates.
Suggested Uses
• Nanoelectronic materials, tools, and equipment
• Carbon nanotube electronics
• Field emission displays: High-definition television, Indoor/Outdoor signage, Automotive displays
• Sensors
• Memory devices: Logic gates, molecular quantum computing
• Medical devices
• MEMS/NEMS (i.e. for aerospace applications)
Advantages
• Rapid, high-rate, large-scale assembly
• Scalable processes for industrial manufacturing
• No need for high temperatures during assembly
• Decreased exposure to acidic environments
• Solutions to leakage power consumption, variability
• Viable commercial scale-up
• Increased functional density and performance
• High processing power
Detailed Description
The invention describes a method for three-dimensional directed assembly of single-wall carbon nanotubes (SWNT) into porous alumina nanotemplates. The process is carried out at ambient temperatures. This technique will be useful for large-scale, rapid, three-dimensional assembly of SWNT for nanoscale semiconductor electronics applications. Commercial interest in nanotubes is rapidly increasing. SWNTs are one of the most popular structures in nanoscale electronics. They have tremendous importance, particularly as interconnects, since current materials do not meet required resistivity for smaller diameters. The proposed method overcomes current limitations to allow for easily scalable high-rate manufacturing.
File Number: INV-0851/PCT
Other Information:
Investigator(s)
Srinivas Sridhar Dattatri Nagesha Evin Gultepe
Contact
Anthony N. Pirri, a.pirri@neu.edu
| Patent Number(s): | PCT/US09/40346 |
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This innovation currently is not available for online licensing. Please contact Anthony Pirri at Northeastern University for more information.
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