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Electrostatic Methods and Apparatus for Mounting and Demounting Particles from a Surface Having an Array of Tacky and Non-Tacky Areas
University of California System: University of California, San Diego Technology Transfer Office
posted on 08/10/2010
Brief description unavailable
Detailed Description
As part of the Tacky Dot® donation, the University is offering for commercialization an improved method for mounting particles on a substrate having both tacky and non-tacky areas using a direct current potential This invention especially has utility for the handling and transfer of solder balls and other conductive particles to form solder bumps on the contact pads of electronic devices.
File Number: 21051
| Patent Number(s): | 6871777, 7191930 |
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| Copyright: | ©2010, The Regents of the University of California |
This innovation currently is not available for online licensing. Please contact University of California, San Diego Technology Transfer Office at University of California System: University of California, San Diego Technology Transfer Office for more information.
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