Follow this innovation
[ via 
] [?]
ELECTROLYTIC DEPOSITION OF COPPER ONTO ALUMINUM
University of Missouri System: Missouri University of Science and Technology
posted on 07/02/2009
ELECTROLYTIC DEPOSITION OF COPPER ONTO ALUMINUM
Detailed Description
Non-Confidential Abstract of Invention: A process has been developed which allows a good quality, uniform adherent deposit of copper to be spontaneously placed on an aluminum film. The reaction occurs directly in a suitable organic media which is not a good electrolyte.
File Number: 97UMR032
Web site: http://ecodevo.mst.edu
Other Information:
Case Manager: Keith D. Strassner, kdstrass@mst.edu
This innovation currently is not available for online licensing. Please contact Keith Strassner at University of Missouri System: Missouri University of Science and Technology for more information.
request more info
ProfileFind more innovations
